Patent Application for R&D Power Relay Assembly System
    2017.03.29 11:49
    • 작성자 admin
    • 조회 12


    HK Semitech Co., Ltd. jointly obtained a patent (Application No. 10-2017-0040060) for the "Power Relay Assembly System" with LS Automotive Co., Ltd. on March 27.

    This patent represents a significant achievement in the development of an environmentally friendly vehicle (xEV) high-voltage battery switch device that incorporates electronic switches,
    achieved through collaborative research and development with our client, LS Automotive Co., Ltd..