Patent Application for R&D Power Relay Assembly System
2017.03.29 11:49- 작성자 admin
- 조회 24
HK Semitech Co., Ltd. jointly obtained a patent (Application No. 10-2017-0040060) for the "Power Relay Assembly System" with LS Automotive Co., Ltd. on March 27.
This patent represents a significant achievement in the development of an environmentally friendly vehicle (xEV) high-voltage battery switch device that incorporates electronic switches,
achieved through collaborative research and development with our client, LS Automotive Co., Ltd..
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